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电镀铅液, metal content ^=82.2g/l  
电镀铅液, metal content ^=82.2g/l

CAS:MFCD00011151
Lead plating solution

  • ¥287
(±)-6-甲基-5-庚烯基-2-醇,98%  
(±)-6-甲基-5-庚烯基-2-醇,98%

CAS:1569-60-4
(±)-6-Methyl-5-hepten-2-ol

  • ¥287
水合锡酸钠, Reagent Grade  
水合锡酸钠, Reagent Grade

CAS:12058-66-1
Sodium tin(IV) oxide hydrate

  • ¥287
锡铅合金喷镀溶液  
锡铅合金喷镀溶液

CAS:MFCD00801106
Tin Lead plating solution

  • ¥287
锡喷镀溶液, metal content ^=82.2g/l  
锡喷镀溶液, metal content ^=82.2g/l

CAS:MFCD00011238
Tin plating solution

  • ¥287
线性重烷基苯磺酸, 97%  
线性重烷基苯磺酸, 97%

CAS:271-528-9
Linear alkylbenzenesulfonic acid

  • ¥290
吡啶-3-乙酰胺,99%  
吡啶-3-乙酰胺,99%

CAS:3724-16-1
3-Pyridineacetamide

  • ¥290
钛酸铅, polymeric precursor, oxide >30 wt%  
钛酸铅, polymeric precursor, oxide >30 wt%

CAS:MFCD00011159
Lead titanium oxide

  • ¥294
新癸酸锶, Sr 16-21%  
新癸酸锶, Sr 16-21%

CAS:MFCD00070439
Strontium neodecanoate

  • ¥294
草酸镧(III) 水合物  
草酸镧(III) 水合物

CAS:79079-18-8
Lanthanum(III) oxalate hydrate

  • ¥295
锌铜混合物质, -100 mesh, 99% (metals basis)  
锌铜混合物质, -100 mesh, 99% (metals basis)

CAS:MFCD03102068
Zinc Copper composite

  • ¥295
氨基磺酸镁水合物, 99%  
氨基磺酸镁水合物, 99%

CAS:MFCD00210632
Magnesium sulfamate hydrate

  • ¥299
Thallium(I) 2,4-pentanedionate, 97+%  
Thallium(I) 2,4-pentanedionate, 97+%

CAS:25955-51-5
Thallium(I) 2

  • ¥301
四氯化锡(IV)水合物, 98%  
四氯化锡(IV)水合物, 98%

CAS:231-588-9
Tin(IV) chloride hydrate

  • ¥301

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